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跟踪 Dan Nystedt 的最新研究

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    Real FeRAM work, and a strong Intel/Micron/Berkeley/Cornell team. The pitch is AI memory without EUV. I’ll believe it when the parts qualify. Too many “next memory” stories die on yield, volume, and integration – the same problems that held classic FeRAM back.

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    The Taiwan supply chain rumor early this year was that Google might replace Nvidia as TSMC's biggest customer. Hard to believe then, less so now.

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    India published Semicon 2.0 today, Gazette ID: CG-DL-E-31082026-275860 (English starts page 11) here: https://t.co/HRRa6ORock