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Google has made some “adjustments” in Taiwan but denied rumors alleging 30% to 50% of staff – including senior personnel – had been let go, media report, adding Google Taiwan continues to hire and recently added 60% more office space to its R&D Center in Taipei. $GOOGL https://t.co/GJAcuwdpmb
Google Cloud Senior Director of Supply Chain Infrastructure Nikhil Cherian named high performance memory the primary constraint in AI servers now as it accounts for over 75% of the build of materials (BOM), media report, adding Google is using a dual hardware-software strategy to break through this ‘AI memory wall’. He made the comments during a presentation at SEMICON Taiwan. $GOOGL $SKHY $SSNLF $MU #semiconductors https://t.co/wI99BP0FwT
TSMC: Demand for AI compute will 5x annually in coming years, leading overall system compute in 2029 to 50x that of 2024, media report, citing April Li, head of AI and HPC Business Development. TSMC estimates 30 to 40GW per year of AI data centers will be built per year, compared to 5 to 6GW of data centers historically. New advances are vital to keep pace, and TSMC aims to have A12 in mass production in 2029, and 14x-reticle size CoWoS packaging in 2028, and more. By 2030, a single AI chip package will hold over 1 trillion transistors, she said. $TSM $NVDA $GOOGL $AVGO #semiconductors https://t.co/q3i45f42lX
Google is set to highlight this year’s SEMICON Taiwan (9/2-4), which is already breaking records in scale, media report. The 3-day semiconductor equipment and materials exhibition opens Wednesday, though some forums start today (Monday). Google’s Chief Technologist for AI Infrastructure Amin Vahdat will deliver a keynote from the eyes of a custom chip developer at the event, making CSPs a new centerpiece. Over 100,000 semiconductor professionals are expected this year, with the exhibition size hitting 4,300 booths, by 1,300 exhibitors. A total of 18 nations have set up in the international pavilion, up 250% over last year, while the Startups area has doubled in size. $GOOGL #SEMI #semiconductors https://t.co/ePSd8wO3qT
Strong demand for Google Tensor Processing Units (TPUs), Intel outsourcing more as it focuses on EMIB, and price increases due to rising costs and demand are all converging into a boom of advanced packaging and testing orders for ASE Technology, media report, adding Google has aggressively expanded TPU volume via partners including Broadcom, MediaTek, Marvell and AMD, leading to substantial add-on orders at ASE. Estimates put Google TPU shipments at 12 to 15 million units by 2028. TSMC remains Google’s chip fabrication and CoWoS partner, with ASE also a major winner from the TPU ramp up. $ASX $GOOGL $INTC #semiconductors https://t.co/rZO9baW1L6
Taiwan prosecutors raided a plant owned by ABF substrate giant Unimicron on Friday over the alleged import of substrates and printed circuit boards (PCBs) made at its China plants and then re-labelling them ‘Made in Taiwan’, media report. Some employees are suspected of crimes including document forgery and product origin fraud. The head of Unimicron’s PCB division was released Saturday on bail of NT$15 million (US$475,000). Several other managers were also released for lower amounts. $NVDA $GOOGL $AMZN $MSFT $META https://t.co/4BvJx3TID4
Intel EMIB advanced packaging has become a confirmed rival to TSMC with strong yields and satisfied customers, media report, citing unnamed supply chain sources, who say Intel’s work with clients Google and MediaTek has been so smooth it indicates that costs and production yields are meeting targets. And with TSMC CoWoS capacity still tight, clients are likely to deepen work with Intel. $INTC $TSM $GOOGL #mediatek #semiconductors https://t.co/h4Bm35spoO