纽约 美东 盘前 04:00–09:30 04:00–09:30

X 原帖证据 · 半导体产业情报

跟踪 Dan Nystedt 的最新研究

只呈现公开原帖与明确出现的股票代码,不把一般讨论自动解释成买卖操作。

等待新帖

已保留历史原帖,当前没有近期入库更新。

按发布时间倒序 · 新加坡时间

$INTC 相关原帖

显示 3 条
  1. 原创
    查看 X 原帖
    Intel plans to raise CPU prices another 10% in early October, the latest of several price increases since late 2025 due to strong demand and rising costs, DigiTimes reports, adding the New Intel also plans to kill off low-margin “small core” CPU products as its shrinks its product portfolio to concentrate on high margin CPUs – a departure from the old Intel, which competed vigorously in all segments. Hardest hit would be Industrial / embedded / IoT, potentially opening the door for Arm-based CPUs from MediaTek, Qualcomm, the report says, citing unnamed industry sources. Intel is also cutting staff, already having pared payrolls down to around 75,000, also cut management to 6 from 12, and could cut another 5%-…展开完整原文

    Intel plans to raise CPU prices another 10% in early October, the latest of several price increases since late 2025 due to strong demand and rising costs, DigiTimes reports, adding the New Intel also plans to kill off low-margin “small core” CPU products as its shrinks its product portfolio to concentrate on high margin CPUs – a departure from the old Intel, which competed vigorously in all segments. Hardest hit would be Industrial / embedded / IoT, potentially opening the door for Arm-based CPUs from MediaTek, Qualcomm, the report says, citing unnamed industry sources. Intel is also cutting staff, already having pared payrolls down to around 75,000, also cut management to 6 from 12, and could cut another 5%-10% of employees, the report says, ultimately ending at 70,000. Finally, the report says the PC market could continue to struggle in 2027, with shipments dropping to 250 million from 260 million this year amid continued high component prices, such as memory. – Very interesting report. $INTC $ARM $QCOM #mediatek https://t.co/RPN4u93TBa

  2. 原创
    查看 X 原帖

    Strong demand for Google Tensor Processing Units (TPUs), Intel outsourcing more as it focuses on EMIB, and price increases due to rising costs and demand are all converging into a boom of advanced packaging and testing orders for ASE Technology, media report, adding Google has aggressively expanded TPU volume via partners including Broadcom, MediaTek, Marvell and AMD, leading to substantial add-on orders at ASE. Estimates put Google TPU shipments at 12 to 15 million units by 2028. TSMC remains Google’s chip fabrication and CoWoS partner, with ASE also a major winner from the TPU ramp up. $ASX $GOOGL $INTC #semiconductors https://t.co/rZO9baW1L6

  3. 原创
    查看 X 原帖

    Intel EMIB advanced packaging has become a confirmed rival to TSMC with strong yields and satisfied customers, media report, citing unnamed supply chain sources, who say Intel’s work with clients Google and MediaTek has been so smooth it indicates that costs and production yields are meeting targets. And with TSMC CoWoS capacity still tight, clients are likely to deepen work with Intel. $INTC $TSM $GOOGL #mediatek #semiconductors https://t.co/h4Bm35spoO