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$TSM 相关原帖

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  1. 原创
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    TSMC’s revenue rose 53.3% year-on-year in August to a fresh record high NT$514.81 billion (US$16.09B), the 4th consecutive monthly high amid robust global AI-related demand. The previous record was NT$467.58 billion in July. TSMC did not provide a US$ figure. The figure is based on its forex guidance for the 3rd quarter. 1/3 $TSM $AAPL $NVDA $AMD $AVGO $QCOM #semiconductors #semiconductor

  2. 原创
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    TSMC may be in 1.4nm mass production by end-2027, a year earlier than planned, media report, adding the chip giant could begin commissioning equipment by April. Construction on its 1.4nm fab cluster near Taichung, central Taiwan, is in full acceleration mode, with the steel framework on the first fab (P1) already done. TSMC has applied to the Central Taiwan Science Park (CTSP) to build 2 temporary offices at the site, a sign production will begin early, the report says. Concrete is being poured for the 2nd fab at the site (P2), and construction could be done by October-2027. A building permit for the 3rd fab has already been granted, and TSMC has applied for a 4th fab there as well. The four fabs are expected t…展开完整原文

    TSMC may be in 1.4nm mass production by end-2027, a year earlier than planned, media report, adding the chip giant could begin commissioning equipment by April. Construction on its 1.4nm fab cluster near Taichung, central Taiwan, is in full acceleration mode, with the steel framework on the first fab (P1) already done. TSMC has applied to the Central Taiwan Science Park (CTSP) to build 2 temporary offices at the site, a sign production will begin early, the report says. Concrete is being poured for the 2nd fab at the site (P2), and construction could be done by October-2027. A building permit for the 3rd fab has already been granted, and TSMC has applied for a 4th fab there as well. The four fabs are expected to require 9,000 – 10,000 workers and annual output valued exceeding NT$500 billion (US$15.9B). $TSM https://t.co/vHm34kKiCP

  3. 原创
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    TSMC has sped up the pace of fab building 5x the historical pace and has 13 under construction in Taiwan and another 5 to 6 in progress overseas – nearly 20 in all, but still cannot meet demand, said Co-COO Cliff Hou, media report, naming construction workers as a key bottleneck. Also, TSMC’s demand for equipment has nearly doubled since the end of last year – a pace equipment suppliers cannot keep up with. $ASML $AMAT $TSM #semiconductors

  4. 原创
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    TSMC may raise prices across all process nodes by another 10% to 15% amid strong demand for AI-related chips - and Samsung’s ability to hike prices 10%-15% for its 4nm and 5nm offerings, media report, citing market expectations (NOT from TSMC). The market also reportedly sees follow on price hikes for N2, N3 and N5 advanced processes of 10% by end-2027. $TSM $SSNLF #Samsung https://t.co/WA85e88Tmp

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    The US will unveil Section 301 semiconductor tariffs around the time China Chairman Xi visits the US for a summit with President Trump, media report, adding Taiwan’s tariff rate will likely be close to the 15% already negotiated with the US due to major investment commitments by Taiwan’s chip and AI stack companies. (Note: We count over US$300 billion in solid commitments). $TSM #GlobalWafers #Wistron #Foxconn #Quanta #semiconductors https://t.co/efFhdc7WsP

  6. 原创
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    TSMC: Demand for AI compute will 5x annually in coming years, leading overall system compute in 2029 to 50x that of 2024, media report, citing April Li, head of AI and HPC Business Development. TSMC estimates 30 to 40GW per year of AI data centers will be built per year, compared to 5 to 6GW of data centers historically. New advances are vital to keep pace, and TSMC aims to have A12 in mass production in 2029, and 14x-reticle size CoWoS packaging in 2028, and more. By 2030, a single AI chip package will hold over 1 trillion transistors, she said. $TSM $NVDA $GOOGL $AVGO #semiconductors https://t.co/q3i45f42lX

  7. 原创
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    Nvidia jump starts AI PC market: Asustek’s and MSI’s initial batches of AI PCs designed around Nvidia RTX Spark processors have completely sold out in pre-order, media report, and both have already asked Nvidia for more chips, which are made on TSMC’s 3nm process. There are 2 main RTX Spark chips, the N1 for mainstream AI PCs and the N1x for high-end. $NVDA $TSM #Asustek #MSI #AIPC https://t.co/mqCY90xEMF

  8. 原创
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    Nvidia jump starts AI PC market: Asustek’s and MSI’s initial batches of AI PCs designed around Nvidia RTX Spark processors have completely sold out in pre-order, media report, and both have already asking Nvidia for more chips, which are made on TSMC’s 3nm process. There are 2 main RTX Spark chips, the N1 for mainstream AI PCs and the N1x for high-end. $NVDA $TSM #Asustek #MSI #AIPC https://t.co/mqCY90xEMF

  9. 原创
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    TSMC’s 2nd quarter employee profit-sharing payout hit NT$36 billion (US$1.14B), up over-50% from the same time last year, media report, and raising the total 1st half-2026 bonus to NT$70.35B, up 54.3%. TSMC’s profit sharing bonuses are benefitting from the strong AI trend, as the chip giant’s net profit in the 2nd quarter rose 77.4% to NT$706.56B. In 2025, the bonus rose 30% versus 2024. $TSM #semiconductors https://t.co/YCEvraGgSG

  10. 原创
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    Apple’s new M6 laptop/compute chip has continued the use of SoIC-MH advanced packaging, but high-end M-series chips (M6 Pro, Max, Ultra) may use 2 advanced packaging techniques, SoIC-MH for interconnect density and WMCM to integrate logic, LPDDR memory and high-speed I/O, media report, noting TSMC is readying capacity in 3 plants: Zhunan AP6, Longtan AP3 and Chiayi AP7. Analysts estimate WMCM capacity could reach 60,000 wafers-per-month (wpm) by end 2026 and over 120,000wpm in 2027. Important to note that the M6 is a monolithic die – everything on one slab of silicon – while the Pro, Max and Ultra versions are multi-die (chiplets) which need to be ‘stitched’ together via advanced packaging techniques. SoIC-MH:…展开完整原文

    Apple’s new M6 laptop/compute chip has continued the use of SoIC-MH advanced packaging, but high-end M-series chips (M6 Pro, Max, Ultra) may use 2 advanced packaging techniques, SoIC-MH for interconnect density and WMCM to integrate logic, LPDDR memory and high-speed I/O, media report, noting TSMC is readying capacity in 3 plants: Zhunan AP6, Longtan AP3 and Chiayi AP7. Analysts estimate WMCM capacity could reach 60,000 wafers-per-month (wpm) by end 2026 and over 120,000wpm in 2027. Important to note that the M6 is a monolithic die – everything on one slab of silicon – while the Pro, Max and Ultra versions are multi-die (chiplets) which need to be ‘stitched’ together via advanced packaging techniques. SoIC-MH: System-on-Integrated-Chips Multi-Height WMCM: Wafer-Level Multi-Chip Module $AAPL $TSM #semiconductors https://t.co/n7SCuuvFDF

  11. 原创
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    Intel EMIB advanced packaging has become a confirmed rival to TSMC with strong yields and satisfied customers, media report, citing unnamed supply chain sources, who say Intel’s work with clients Google and MediaTek has been so smooth it indicates that costs and production yields are meeting targets. And with TSMC CoWoS capacity still tight, clients are likely to deepen work with Intel. $INTC $TSM $GOOGL #mediatek #semiconductors https://t.co/h4Bm35spoO